http://www.www.datasheet4u.com

900,000+ Datasheet PDF Search and Download

Datasheet4U offers most rated semiconductors datasheets pdf




Osram Opto Semiconductors
Osram Opto Semiconductors

F1047A Datasheet Preview

F1047A Datasheet

Infrared Emitting Diode Chip

No Preview Available !

F1047A pdf
www.DataSheet4U.com
GaAlAs-Infrarot-Lumineszenzdiode (880 nm)
GaAlAs Infrared Emitting Diode (880 nm)
F 1047A
F 1047B
Vorläufige Daten / Preliminary Data
Wesentliche Merkmale
• Typ. Gesamtleistung: 22 mW @ 100 mA im
TOPLED® Gehäuse
Chipgröße 300 x 300 µm2
GaAlAs-LED mit sehr hohem Wirkungsgrad
Hohe Zuverlässigkeit
Hohe Impulsbelastbarkeit
Gute spektrale Anpassung an
Si-Fotoempfänger
Vorderseitenmetallisierung: Aluminium
Rückseitenmetallisierung: Goldlegierung
Lieferung: vereinzelt auf Folie
Features
Typ. total radiant power: 22 mW @ 100 mA in
TOPLED® package.
Chipsize: 300 x 300 µm²
Very highly efficient GaAlAs LED
High reliability
High pulse handling capability
Good spectral match to silicon photodetectors
Frontside metallization: aluminum
Backside metallization: gold alloy
Delivery: diced on foil
Anwendungen
IIR-Fernsteuerung von Fernseh-, Rundfunk-
und Videogeräten, Lichtdimmern
Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
Lichtschranken bis 500 kHz
Sensorik
Diskrete Optokoppler
Applications
IR remote control for hifi and TV sets, video
tape recorder, dimmers
Remote control for steady and varying
intensity
Light-reflection switches (max. 500 kHz)
Sensor technology
Discrete optocouplers
Typ
Type
F 1047A
F 1047B
Bestellnummer
Ordering Code
Q67220-C1386
on request
Beschreibung
Description
Infrarot emittierender Chip, Oberseite Kathodenanschluss
Infrared emitting die, top side cathode connection
Infrarot emittierender Chip, Oberseite Kathodenanschluss,
Oberfläche aufgerauht.
Infrared emitting die, top side cathode connection, surface
frosted
2003-04-11
1




Osram Opto Semiconductors
Osram Opto Semiconductors

F1047A Datasheet Preview

F1047A Datasheet

Infrared Emitting Diode Chip

No Preview Available !

F1047A pdf
www.DataSheet4U.com
F 1047A, F 1047B
Elektrische Werte (TA = 25 °C)
Electrical values1) (TA = 25 °C)
Bezeichnung
Parameter
Emissionswellenlänge
Peak wavelength
IF = 10 mA
Spektrale Bandbreite bei 50% von Imax,
Spectral bandwidth at 50% of Imax
IF = 10 mA
Schaltzeiten, Ie von 10% auf 90% und von 90% auf
10%, bei IF = 100 mA, RL = 50
Switching times, Ie from 10% to 90% and from 90%
to 10%, IF = 100 mA, RL = 50
Sperrspannung
Reverse voltage
IR = 1µA
Durchlaβspannung
Forward voltage
IF = 100 mA
Strahlungsleistung
Radiant Power3)
IF = 100 mA
F1047A
F1047B
Symbol
Symbol
λpeak
∆λ
tr, tf
VR
VF
Φe
min.
5
Wert
Value2)
typ.
880
max.
Einheit
Unit
nm
100 nm
0.5/0.4
µs
V
1.9 V
12 mW
14 mW
Photostrom (Spezifikationsparameter)
Photocurrent (specified parameter)
IF = 100 mA
F1047A
F1047B
Ie
0.50
0.65
a.u.
a.u.
1) Measurement limits describe actual settings and do not include measurement uncertainties. Each wafer and each
fragment of a wafer is subject to final testing. The wafer or its pieces are individually attached on foils (ring). Sample
chips are picked from each foil and placed on a special carrier for measurement purposes. The sampling density is one
chip per 1cm². If a sample fails, the area around that sample is tested again by taking samples in fourfold density. If a
sample fails in that measurement, an area of 0,25 cm² around each failed sample is marked by pen.
All el. values are referenced to the vendor's measurement system (correlation to customer product(s) is required)
2) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.
This is not a specified value
3) Radiant power is measured on TO-18 header in integrating sphere.
2003-04-11
2




Osram Opto Semiconductors
Osram Opto Semiconductors

F1047A Datasheet Preview

F1047A Datasheet

Infrared Emitting Diode Chip

No Preview Available !

F1047A pdf
www.DataSheet4U.com
F 1047A, F 1047B
Mechanische Werte
Mechanical values
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value1)
Einheit
Unit
min. typ.
max.
Chipkantenlänge (x-Richtung)
Length of chip edge (x-direction)
Lx
0.28 0.30
0.32 mm
Chipkantenlänge (y-Richtung)
Length of chip edge (y-direction)
Ly
0.28 0.30
0.32 mm
Durchmesser des Wafers
Diameter of the wafer
D 48 mm
Chiphöhe
Die height
H 210 µm
Bondpaddurchmesser
Diameter of bondpad
d 130 µm
Weitere Informationen
Additional information2)
Vorderseitenmetallisierung
Metallization frontside
Aluminium
Aluminum
Rückseitenmetallisierung
Metallization backside
Goldlegierung
Au-Alloy
Trennverfahren
Dicing
Sägen
Sawing
Verbindung Chip - Träger
Die bonding
Kleben
Glueing
1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.
This is not a specified value
2) All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspection
A63501-Q0013-N001-*-76G3:The visual inspection shall be made in accordance to the "specification of the visual
inspection" as referenced.The visual inspection of chip backside is performed by eye for 100% of the area of each
wafer. If decisions (good/bad) are not possible additional a stereo microscope with incident light with 40x-80x
magnification is used. Areas > ¼ cm² which have an amount of more than 5% failed dies will be marked manually with
pen.The visual inspection of chip frontside is performed by a stereo microscope with incident light with 40x-80x
magnification for 100% of the area of each wafer.Areas greater than 5x5 mm² and with a failure density higher than
25% are marked by pen and inked around. Areas with failure density higher than 10% each failure die is inked
individually.The inked area from backside must be transfered to frontside and has to be marked manually with pen and
inked around.The quality inspection (final visual inspection) is performed by production. An additional visual
inspection step as special release procedure by QM after the final visual inspection is not installed.
2003-04-11
3




Part Number F1047A
Description Infrared Emitting Diode Chip
Maker Osram Opto Semiconductors
Total Page 6 Pages
PDF Download
F1047A pdf
Download PDF File
F1047A pdf
View for Mobile






Related Datasheet

1 F1047A Infrared Emitting Diode Chip Osram Opto Semiconductors
Osram Opto Semiconductors
F1047A pdf
2 F1047B Infrared Emitting Diode Chip Osram Opto Semiconductors
Osram Opto Semiconductors
F1047B pdf




Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z

site map

webmaste! click here

contact us

Buy Components