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NXP Semiconductors Electronic Components Datasheet

74ABT125 Datasheet

Quad buffer

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74ABT125 pdf
74ABT125
Quad buffer; 3-state
Rev. 7 — 25 November 2015
Product data sheet
1. General description
The 74ABT125 high-performance BiCMOS device combines low static and dynamic
power dissipation with high speed and high output drive.
The 74ABT125 device is a quad buffer that is ideal for driving bus lines. The device
features four output enable inputs (1OE, 2OE, 3OE, 4OE), each controlling one of the
3-state outputs.
2. Features and benefits
Quad bus interface
3-state buffers
Live insertion and extraction permitted
Output capability: HIGH 32 mA; LOW +64 mA
Power-up 3-state
Inputs are disabled during 3-state mode
Latch-up protection exceeds 500 mA per JESD78 class II level A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 C to +85 C
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range
74ABT125D 40 C to +85 C
74ABT125DB 40 C to +85 C
74ABT125PW 40 C to +85 C
74ABT125BQ 40 C to +85 C
Name
Description
SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SSOP14
plastic shrink small outline package; 14 leads;
body width 5.3 mm
TSSOP14 plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5 3 0.85 mm
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1


NXP Semiconductors Electronic Components Datasheet

74ABT125 Datasheet

Quad buffer

No Preview Available !

74ABT125 pdf
NXP Semiconductors
4. Functional diagram
74ABT125
Quad buffer; 3-state
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Fig 1. Logic symbol

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PQD
Fig 2. IEC logic symbol
5. Pinning information
5.1 Pinning
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PQD
Fig 3. Logic diagram (one buffer)
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Fig 4. Pin configuration SO14 and (T)SSOP14
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(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 5. Pin configuration DHVQFN14
74ABT125
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 25 November 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 15


Part Number 74ABT125
Description Quad buffer
Maker NXP
Total Page 15 Pages
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