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Freescale Semiconductor Electronic Components Datasheet

MCIMX357CVM5B Datasheet

i.MX35 Applications Processors

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MCIMX357CVM5B pdf
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCIMX35SR2CEC
Rev. 10, 06/2012
IMX35
i.MX35 Applications
Processors for
Industrial and
Consumer Products
Package Information
Plastic Package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The i.MX353 and the i.MX357 multimedia applications
processors represent the next generation of ARM11
products with the right performance and integration to
address applications within the industrial and consumer
markets for applications such as HMI and display
controllers. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX353 and
i.MX357 devices and referred to singularly throughout
this document as i.MX35 or MCIMX35. The i.MX353
devices do not include a graphics processing unit
(GPU). For information on i.MX35 devices for
automotive applications, please refer to document
number, MCIMX35SR2AEC.
The i.MX35 processor takes advantage of the
ARM1136JF-S™ core running at 532 MHz that is
boosted by a multi-level cache system and integrated
features such as LCD controller, Ethernet, and graphics
acceleration for creating rich user interfaces.
The i.MX35 supports connections to various types of
external memories, such as SDRAM, mobile DDR, and
DDR2, SLC and MCL NAND Flash, NOR Flash and
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional Description and Application Information. . . . . . 4
2.1. Application Processor Domain Overview . . . . . . . . . 5
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3. Advanced Power Management Overview . . . . . . . . 6
2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Signal Descriptions: Special Function Related Pins . . . . 12
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
4.6. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 19
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23
4.9. Module-Level AC Electrical Specifications . . . . . . . 29
5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 130
5.1. MAPBGA Production Package 1568-01, 17 × 17 mm,
0.8 Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
5.2. MAPBGA Signal Assignments . . . . . . . . . . . . . . . 132
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 144
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
© Freescale Semiconductor, Inc., 2010. All rights reserved.
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Freescale Semiconductor Electronic Components Datasheet

MCIMX357CVM5B Datasheet

i.MX35 Applications Processors

No Preview Available !

MCIMX357CVM5B pdf
SRAM. The devices can be connected to a variety of external devices such as USB 2.0 OTG, ATA,
MMC/SDIO, and Compact Flash.
1.1 Features
It provides low-power solutions for applications demanding high-performance multimedia and graphics.
The i.MX35 is based on the ARM1136 platform, which has the following features:
• ARM1136JF-S processor, version r1p3
• 16-Kbyte L1 instruction cache
• 16-Kbyte L1 data cache
• 128-Kbyte L2 cache, version r0p4
• 128 Kbytes of internal SRAM
• Vector floating point unit (VFP11)
To boost multimedia performance, the following hardware accelerators are integrated:
• Image processing unit (IPU)
• OpenVG 1.1 graphics processing unit (GPU) (not available for the MCIMX351)
The MCIMX35 provides the following interfaces to external devices (some of these interfaces are muxed
and not available simultaneously):
• 2 controller area network (CAN) interfaces
• 2 SDIO/MMC interfaces, 1 SDIO/CE-ATA interface (CE-ATA is not available for the MCIMX351)
• 32-bit mobile DDR, DDR2 (4-bank architecture), and SDRAM (up to 133 MHz)
• 2 configurable serial peripheral interfaces (CSPI) (up to 52 Mbps each)
• Enhanced serial audio interface (ESAI)
• 2 synchronous serial interfaces (SSI)
• Ethernet MAC 10/100 Mbps
• 1 USB 2.0 host with ULPI interface or internal full-speed PHY. Up to 480 Mbps if external HS
PHY is used.
• 1 USB 2.0 OTG (up to 480 Mbps) controller with internal high-speed OTG PHY
• Flash controller—MLC/SLC NAND and NOR
• GPIO with interrupt capabilities
• 3 I2C modules (up to 400 Kbytes each)
• JTAG
• Key pin port
• Asynchronous sample rate converter (ASRC)
• 1-Wire
• Parallel camera sensor (4/8/10/16-bit data port for video color models: YCC, YUV, 30 Mpixels/s)
• Parallel display (primary up to 24-bit, 1024 x 1024)
• Parallel ATA (up to 66 Mbytes) (not available for the MCIMX351)
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 10
2 Freescale Semiconductor
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Part Number MCIMX357CVM5B
Description i.MX35 Applications Processors
Maker Freescale Semiconductor
Total Page 30 Pages
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