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4 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
4 Hits
x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
3 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
3 Hits
x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
3 Hits
x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
• Small surface mounting type • High reliability
BZT55C2V0 THRU
BZT55C75
500 mW Zener Diode 2.0 to 75 Volts
Absolute Maximum Ratings
Symbol PD IZ T...
·
2 Hits
• Small surface mounting type • High reliability
BZT55C2V0 THRU
BZT55C75
500 mW Zener Diode 2.0 to 75 Volts
Absolute Maximum Ratings
Symbol PD IZ T...
·
2 Hits
• Small surface mounting type • High reliability
BZT55C2V0 THRU
BZT55C75
500 mW Zener Diode 2.0 to 75 Volts
Absolute Maximum Ratings
Symbol PD IZ T...
·
2 Hits
• Small surface mounting type • High reliability
BZT55C2V0 THRU
BZT55C75
500 mW Zener Diode 2.0 to 75 Volts
Absolute Maximum Ratings
Symbol PD IZ T...
·
2 Hits
• Small surface mounting type • High reliability
BZT55C2V0 THRU
BZT55C75
500 mW Zener Diode 2.0 to 75 Volts
Absolute Maximum Ratings
Symbol PD IZ T...
·
2 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction
x 500mW Power Dissipation on Ceramic PCB
x General Purpose Medium Current
x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction
x 500mW Power Dissipation on Ceramic PCB
x General Purpose Medium Current
x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
2 Hits
x Planar Die Construction x 410mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Proces...
·
1 Hits
• Small surface mounting type • High reliability
BZT55C2V0 THRU
BZT55C75
500 mW Zener Diode 2.0 to 75 Volts
Absolute Maximum Ratings
Symbol PD IZ T...
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