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• State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
• P-N-P Inputs Reduce DC Loading • ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
• 3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
• Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
SN54BCT244, SN74BCT244 OCTAL BUFFERS/DRIVERS
WITH 3ĆSTATE OUTPUTS
SCBS006E − OCTOBER 1987 − REVISED APRIL 1994
SN54BCT244 . . . J OR W PACKAGE SN74BCT244 . . .
SN74BCT244 Datasheet
