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SN65LVDT250 - LVDS 4x4 CROSSPOINT SWITCH

Download the SN65LVDT250 datasheet PDF. This datasheet also covers the SN65LVDS250 variant, as both devices belong to the same lvds 4x4 crosspoint switch family and are provided as variant models within a single manufacturer datasheet.

Description

The SN65LVDS250 and SN65LVDT250 are 4x4 nonblocking crosspoint switches in a flow-through pin-out allowing for ease in PCB layout.

Low-voltage differential signaling (LVDS) is used to achieve a high-speed data throughput while using low power.

Features

  • Greater Than 2.0 Gbps Operation.
  • Nonblocking Architecture Allows Each Output to be Connected to Any Input.
  • Pk-Pk Jitter:.
  • 60 ps Typical at 2.0 Gbps.
  • 110 ps Typical at 2.5 Gbps.
  • Compatible With ANSI TIA/EIA-644-A LVDS Standard.
  • Available Packaging 38-Pin TSSOP.
  • 25 mV of Input Voltage Threshold Hysteresis.
  • Propagation Delay Times: 800 ps Typical.
  • Inputs Electrically Compatible With LVPECL, CML and LVDS Signa.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (SN65LVDS250-etcTI.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Texas Instruments

Part Number Description
SN65LVDT2 High-Speed Differential Line Drivers/Receivers
SN65LVDT100 Differential Translator/Repeater
SN65LVDT101 Differential Translator/Repeater
SN65LVDT122 LVDS CROSSPOINT SWITCH
SN65LVDT125 LVDS 4x4 CROSSPOINT SWITCH

Full PDF Text Transcription

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www.ti.com SN65LVDS250 SN65LVDT250 SLLS594B – MARCH 2004 – REVISED OCTOBER 2004 LVDS 4x4 CROSSPOINT SWITCH FEATURES • Greater Than 2.0 Gbps Operation • Nonblocking Architecture Allows Each Output to be Connected to Any Input • Pk-Pk Jitter: – 60 ps Typical at 2.0 Gbps – 110 ps Typical at 2.5 Gbps • Compatible With ANSI TIA/EIA-644-A LVDS Standard • Available Packaging 38-Pin TSSOP • 25 mV of Input Voltage Threshold Hysteresis • Propagation Delay Times: 800 ps Typical • Inputs Electrically Compatible With LVPECL, CML and LVDS Signal Levels • Operates From a Single 3.
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