CTCD110CA
Key Features
- 0.319(8.10) 0.311(7.90)
- Lead free product
- Leadless chip form , no lead damage
- Lead-free solder joint , no wire bond & lead frame
- Plastic package has Underwriters Laboratory Flammability
- For surface mounted applications in order to optimize board space E
- Low profile package E
- Built-in strain relief
- Glass passivated junction
- Low inductance
