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IC37 - Dual Inline Package

Features

  • í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 2.4 A B±0.05 0.36 -0.1 +0.2 B±0.1 1.8 3.2 H J±0.2 J±0.1 2.54±0.05 (Contact pos. ) D±0.2 +0.2 C -0.3 E +0.3 0 G F 2.54±0.1 14.5 2- Æ3.2 1.5 4.0 G±0.1 2- Æ3.2 0.5 3.5.

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Datasheet Details

Part number IC37
Manufacturer Yamaichi Electronics
File Size 57.04 KB
Description Dual Inline Package
Datasheet download datasheet IC37 Datasheet

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Full PDF Text Transcription

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IC37 Series Specifications Dual Inline Package (DIP) Part Number (Details) Insulation Resistance: 1,000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 20m W max. at 10mA /20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS) Mating Cycles: 25,000 to 50,000 insertions IC37N Series No. R B - 14 03 - G 4 Housing Material R =PPS Contact Plating: B = Mating Ter. 0.3µm Au Solder Ter. 0.1µm Au Materials and Finish Housing: Polyphenylenesulfide (PPS), glass filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel No.
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