GS2G
FEATURE
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed
Fig1: SMA/DO-214AC- FOR OPEN JUNCTION DICE PACKAGING OUTLINE
260°C /1 0sec/0.375" lead length at 5 lbs tension .For surface mounted application. .Easy pick and place.
MECHANICAL DATA
.Case: Molded plastic .Epoxy: UL94V-0 rate flame retardant .Lead: MIL-STD- 202E, Method 208 guaranteed .Polarity:Color band denotes cathode end .Packaging:12mm tape per EIA STD RS-481 .Mounting position: Any
Fig2: SMA/DO-214AC FOR GLASS PASSIVATED DICE PACKAGING OUTLINE
NO Fig1 mm
A 1.9 2.4 B 1.2 1.8 C 0.23MAX D 2.4 2.9 E 3.8 4.6 F 0.8 1.8 G 4.8 5.80
Fig2 mm
1.98 2.3 1.35 1.6 0.2MAX 2.4 2.9 3.8 4.6 0.8 1.8 4.8 5.80
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at...
