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XCCACEM32 - (XCCACEM16 - XCCACEM64) System ACE MPM Solution

Download the XCCACEM32 datasheet PDF. This datasheet also covers the XCCACEM16 variant, as both devices belong to the same (xccacem16 - xccacem64) system ace mpm solution family and are provided as variant models within a single manufacturer datasheet.

Description

The System ACE Multi-Package Module (MPM) solution addresses the need for a space-efficient, pre-engineered, high-density configuration solution in multiple FPGA systems.

Features

  • tMAP bus and is connected to D1 on all target FPGAs. For Slave-Serial configuration mode, CFG_DATA[2] is the serial data signal for Serial-Slave Chai.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (XCCACEM16_XILINX.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Xilinx (now AMD)

Part Number Description
XCCACEM16 (XCCACEM16 - XCCACEM64) System ACE MPM Solution
XCCACEM64 (XCCACEM16 - XCCACEM64) System ACE MPM Solution
XCCACE-TQ144 System ACE CompactFlash Solution
XCCACE-TQ144I System ACE CompactFlash Solution
XCCACE128-I System ACE CompactFlash Solution

Full PDF Text Transcription

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www.DataSheet4U.com 0 R System ACE™ MPM Solution 0 0 DS087 (v1.2) June 7, 2002 Advance Product Specification Summary • System level, high capacity, pre-configured solution for Virtex™ Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs Industry standard Flash memory die combined with Xilinx controller technology in a single package Effortless density migration: - XCCACEM16-BG388I (16 Megabit (Mb)) - XCCACEM32-BG388I (32 Mb) - XCCACEM64-BG388I (64 Mb) All densities are available in the 388-pin Ball Grid Array package VCC I/O: 1.8V, 2.5V, and 3.
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