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W83792AD - H/W Monitoring IC

General Description

of ASF Severity/Offset Update register Update Application circuit Add the part of “Function Description” Combining with W83792D and W83792AD in one datasheet.

Move Low Bit I/II to 3Eh and 3Fh Add description on Voltage translation.

Key Features

  • 2 2.1 2.2 2.3 2.4 2.5 2.6 VCORE Monitoring Items 2 Monitoring Items 2 Address Resolution Protocol (ARP) and Alert-Standard Format (ASF 2.0) 2 Actions Enabling 2 General 2 Package 3 3. 4. 5. KEY.

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Other Datasheets by Winbond

Part Number Description
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.datasheet4u.com W83792AD/D W83792AG/G Winbond H/W Monitoring IC (CSB Version) Date :2006 Apr. Revision: 0.9 W83792AD/AG/D/G W83792AD/D Data Sheet Revision History DATES VERSION WEB VERSION MAIN CONTENTS www.datasheet4u.com PAGES 1 2 3 4 5 6 7 11 20 39 45 48 5-6 11 70-72 12-34 Aug-27-2003 Aug-27-2003 Sep-12-2003 Sep-16-2003 Nov-06-2003 Jan-05-2004 Dec-13-2004 0.6 0.6.1. 0.7 0.82 0.83 N/A N/A N/A N/A N/A N/A N/A Move Low Bit I/II to AEh and AFh Add Description of ASF Severity/Offset Update register Update Application circuit Add the part of “Function Description” Combining with W83792D and W83792AD in one datasheet. Move Low Bit I/II to 3Eh and 3Fh Add description on Voltage translation. The Deletion of Vin4 4.