Datasheet4U Logo Datasheet4U.com

25Q32FWIG - 1.8V 32M-BIT SERIAL FLASH MEMORY

Download the 25Q32FWIG datasheet PDF. This datasheet also covers the 25Q32FWSIG variant, as both devices belong to the same 1.8v 32m-bit serial flash memory family and are provided as variant models within a single manufacturer datasheet.

Description

4 2.

Features

  • 4 3.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (25Q32FWSIG-Winbond.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number 25Q32FWIG
Manufacturer Winbond
File Size 2.15 MB
Description 1.8V 32M-BIT SERIAL FLASH MEMORY
Datasheet download datasheet 25Q32FWIG Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
25Q32BS 32M-BIT SPI NOR FLASH BMSemi
25Q16BSIG Uniform Sector Dual and Quad Serial Flash GigaDevice
25Q80A 8 Megabit Serial Flash Memory EON
25Q80BSIG Dual and Quad Serial Flash GigaDevice
25QF11 Controlled Avalanche Rectifier Toshiba

Other Datasheets by Winbond

Part Number Description
25Q32FWIG 1.8V 32M-BIT SERIAL FLASH MEMORY
25Q32FWIF 1.8V 32M-BIT SERIAL FLASH MEMORY
25Q32FWIQ 1.8V 32M-BIT SERIAL FLASH MEMORY
25Q32FWBIG 1.8V 32M-BIT SERIAL FLASH MEMORY
25Q32FWCIG 1.8V 32M-BIT SERIAL FLASH MEMORY

Full PDF Text Transcription

Click to expand full text
W25Q32FW 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: April 24, 2018 - Revision J W25Q32FW Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 4 2. FEATURES....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............................................ 5 3.
Published: |