BAV16W
Features
FEATU- RBEat Sch process design, excellent power dissipation offers
Package outline
SOD-123 z Fasbt e Sttweritrcehveinrsge Slepaekeagde current and thermal resistance.
- Low profile surface mounted application in order to z Surfoapctiemi Mzeobuonatrd Psapcakcae.ge Ideally Suited for Automatic Insertion
SOD-123H
+ z Fo- r LGowenpeowraelr Ploussrp, hoisgeh e Sffwiciitecnhciyn. g Applications
- High current capability, low forward voltage drop. z Hig- h Hi Cghosnudrguecctaanpacbeility. z Pb- -GFuraeredrpinagcfokraogveerviosltaagveapirloatbecletion.
0.146(3.7) 0.130(3.3)
Ro- HUSltraphroigdhu-scpteefodrswpaitcchkiningg. code suffix ”G”
- Silicon epitaxial planar chip, metal silicon junction.
Ha- lo Legaedn-frfereepeaprtrsomdeuect tenfovirropnamceknitnagl stcaonddaerdssuofffix “H”
MARK-...
