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VT3045CBP - Trench MOS Barrier Schottky Rectifier

Features

  • Trench MOS Schottky technology.
  • Low forward voltage drop, low power losses.
  • High efficiency operation.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC 2 3.
  • Halogen-free according to IEC 61249-2-21 definition VT3045CBP PIN 1 PIN 3 1 PIN 2.

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Datasheet Details

Part number VT3045CBP
Manufacturer Vishay
File Size 178.75 KB
Description Trench MOS Barrier Schottky Rectifier
Datasheet download datasheet VT3045CBP Datasheet

Full PDF Text Transcription

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New Product VT3045CBP Vishay General Semiconductor Trench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection Ultra Low VF = 0.30 V at IF = 5.0 A TMBS ® TO-220AB FEATURES • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC 2 3 • Halogen-free according to IEC 61249-2-21 definition VT3045CBP PIN 1 PIN 3 1 PIN 2 TYPICAL APPLICATIONS For use in solar cell junction box as a bypass diode for protection, using DC forward current without reverse bias. CASE PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM VF at IF = 15 A TOP max. 2 x 15 A 45 V 200 A 0.
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