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VSKL105-12P - ADD-A-PAK Generation VII Power Modules

Download the VSKL105-12P datasheet PDF. This datasheet also covers the VSKT106-16S90P variant, as both devices belong to the same add-a-pak generation vii power modules family and are provided as variant models within a single manufacturer datasheet.

Description

The ADD-A-PAK Generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

Features

  • High voltage.
  • Industrial standard package.
  • Low thermal resistance.
  • UL approved file E78996.
  • Designed and qualified for industrial level.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VSKT106-16S90P-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VSKL105-12P
Manufacturer Vishay
File Size 309.43 KB
Description ADD-A-PAK Generation VII Power Modules
Datasheet download datasheet VSKL105-12P Datasheet

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Other Datasheets by Vishay

Part Number Description
VSKL105-10P ADD-A-PAK Generation VII Power Modules
VSKL105-14P ADD-A-PAK Generation VII Power Modules
VSKL105-16P ADD-A-PAK Generation VII Power Modules
VSKL105-04P ADD-A-PAK Generation VII Power Modules
VSKL105-06P ADD-A-PAK Generation VII Power Modules

Full PDF Text Transcription

Click to expand full text
VSKT105.., VSKH105.., VSKL105.., VSKN105.. Series www.vishay.com Vishay Semiconductors ADD-A-PAK Generation VII Power Modules Thyristor/Diode and Thyristor/Thyristor, 105 A ADD-A-PAK PRODUCT SUMMARY IT(AV) or IF(AV) Type 105 A Modules - Thyristor, Standard MECHANICAL DESCRIPTION The ADD-A-PAK Generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
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