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VS-VSKN105 - ADD-A-PAK Generation VII Power Modules Thyristor/Diode and Thyristor/Thyristor

Download the VS-VSKN105 datasheet PDF. This datasheet also covers the VS-VSKT105 variant, as both devices belong to the same add-a-pak generation vii power modules thyristor/diode and thyristor/thyristor family and are provided as variant models within a single manufacturer datasheet.

Description

The ADD-A-PAK Generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

Features

  • High voltage.
  • Industrial standard package.
  • Low thermal resistance.
  • UL approved file E78996.
  • Designed and qualified for industrial level.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VS-VSKT105-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VS-VSKN105
Manufacturer Vishay
File Size 309.23 KB
Description ADD-A-PAK Generation VII Power Modules Thyristor/Diode and Thyristor/Thyristor
Datasheet download datasheet VS-VSKN105 Datasheet

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Other Datasheets by Vishay

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VS-VSKN26 Thyristor/Diode and Thyristor/Thyristor
VS-VSKN26-04 Thyristor/Diode and Thyristor/Thyristor
VS-VSKN26-06 Thyristor/Diode and Thyristor/Thyristor
VS-VSKN26-08 Thyristor/Diode and Thyristor/Thyristor
VS-VSKN26-10 Thyristor/Diode and Thyristor/Thyristor

Full PDF Text Transcription

Click to expand full text
VS-VSKT105.., VS-VSKH105.., VS-VSKL105.., VS-VSKN105.. Series www.vishay.com Vishay Semiconductors ADD-A-PAK Generation VII Power Modules Thyristor/Diode and Thyristor/Thyristor, 105 A ADD-A-PAK PRODUCT SUMMARY IT(AV) or IF(AV) 105 A Type Modules - Thyristor, Standard MECHANICAL DESCRIPTION The ADD-A-PAK Generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
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