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VS-VSKJ9116 - Power Modules Standard Diode

Download the VS-VSKJ9116 datasheet PDF. This datasheet also covers the VS-VSKD9104 variant, as both devices belong to the same power modules standard diode family and are provided as variant models within a single manufacturer datasheet.

Description

The AAP Gen 7 (TO-240AA), new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

Features

  • High voltage.
  • Industrial standard package.
  • UL approved file E78996.
  • Low thermal resistance.
  • Designed and qualified for industrial level.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VS-VSKD9104-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VS-VSKJ9116
Manufacturer Vishay
File Size 266.72 KB
Description Power Modules Standard Diode
Datasheet download datasheet VS-VSKJ9116 Datasheet

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Other Datasheets by Vishay

Part Number Description
VS-VSKJ9110 Power Modules Standard Diode
VS-VSKJ9112 Power Modules Standard Diode
VS-VSKJ9114 Power Modules Standard Diode
VS-VSKJ9104 Power Modules Standard Diode
VS-VSKJ9106 Power Modules Standard Diode

Full PDF Text Transcription

Click to expand full text
VS-VSKD91.., VS-VSKC91.., VS-VSKJ91.., VS-VSKE91.. Series www.vishay.com Vishay Semiconductors AAP Gen 7 (TO-240AA) Power Modules Standard Diodes, 100 A ADD-A-PAK PRIMARY CHARACTERISTICS IF(AV) 100 A Type Modules - diode, high voltage Package AAP Gen 7 (TO-240AA) Circuit configuration Two diodes doubler circuit, two diodes common cathode, two diodes common anode, single diode MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
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