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VS-UFH60BA65 - Insulated Single Phase Hyperfast Bridge

Description

The semiconductor in the SOT-227 package is isolated from the copper base plate, allowing for common heatsinks and compact assemblies to be built.

Features

  • Hyperfast and soft recovery characteristic.
  • Electrically isolated base plate.
  • Simplified mechanical designs, rapid assembly.
  • High operation junction temperature (TJ max. = 175 °C).
  • Designed and qualified for industrial and consumer level.
  • UL approved file E78996.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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Datasheet Details

Part number VS-UFH60BA65
Manufacturer Vishay
File Size 177.13 KB
Description Insulated Single Phase Hyperfast Bridge
Datasheet download datasheet VS-UFH60BA65 Datasheet

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Full PDF Text Transcription

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www.vishay.com VS-UFH60BA65 Vishay Semiconductors Insulated Single Phase Hyperfast Bridge (Power Modules), 60 A SOT-227 FEATURES • Hyperfast and soft recovery characteristic • Electrically isolated base plate • Simplified mechanical designs, rapid assembly • High operation junction temperature (TJ max. = 175 °C) • Designed and qualified for industrial and consumer level • UL approved file E78996 • Material categorization: for definitions of compliance please see www.vishay.
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