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VS-FCSP05H40TR - Schottky diode

Description

Vishay’s FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.

Features

  • Ultra low VF to footprint area.
  • Very low profile (< 0.6 mm).
  • Low thermal resistance.
  • Supplied tested and on tape and reel.
  • Compliant to RoHS Directive 2002/95/EC FlipKY®.

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Full PDF Text Transcription

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www.vishay.com VS-FCSP05H40TR Vishay Semiconductors FlipKY®, Chip Scale Package Schottky Barrier Rectifier, 0.5 A FEATURES • Ultra low VF to footprint area • Very low profile (< 0.6 mm) • Low thermal resistance • Supplied tested and on tape and reel • Compliant to RoHS Directive 2002/95/EC FlipKY® PRODUCT SUMMARY IF(AV) VR VF at IF IRM max. at 25 °C IRM max. at 125 °C TJ max. EAS 0.5 A 40 V 0.42 V 10 μA 2 mA 150 °C 5 mJ APPLICATIONS • Reverse polarity protection • Current steering • Freewheeling • Flyback • Oring DESCRIPTION Vishay’s FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.
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