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VEMD2023X01 - Silicon PIN Photodiode

Download the VEMD2023X01 datasheet PDF. This datasheet also covers the VEMD2003X01 variant, as both devices belong to the same silicon pin photodiode family and are provided as variant models within a single manufacturer datasheet.

Description

VEMD2003X01 and VEMD2023X01 are high speed and high sensitive PIN photodiodes in a miniature surface mount package (SMD) with dome lens and daylight blocking filter.

Filter is matched with IR emitters operating at wavelength of 830 nm to 950 nm.

The photo sensitive area of the chip is 0.23 mm2.

Features

  • Package type: surface mount.
  • Package form: GW, RGW.
  • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55.
  • AEC-Q101 qualified.
  • High radiant sensitivity.
  • Daylight blocking filter matched with 830 nm to 950 nm IR emitters.
  • Fast response times.
  • Angle of half sensitivity:  = ± 35°.
  • Package matched with IR emitter series VSMB2943X01.
  • Floor life: 4 weeks, MSL 2a, acc. J-STD-020.
  • Lead (Pb)-free reflow solderin.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VEMD2003X01-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VEMD2023X01
Manufacturer Vishay
File Size 197.86 KB
Description Silicon PIN Photodiode
Datasheet download datasheet VEMD2023X01 Datasheet

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Other Datasheets by Vishay

Part Number Description
VEMD2023SLX01 Silicon PIN Photodiode
VEMD2020X01 Silicon PIN Photodiode
VEMD2000X01 Silicon PIN Photodiode
VEMD2003X01 Silicon PIN Photodiode
VEMD2500X01 Silicon PIN Photodiode

Full PDF Text Transcription

Click to expand full text
www.vishay.com VEMD2003X01, VEMD2023X01 Vishay Semiconductors Silicon PIN Photodiode VEMD2003X01 VEMD2023X01 DESCRIPTION VEMD2003X01 and VEMD2023X01 are high speed and high sensitive PIN photodiodes in a miniature surface mount package (SMD) with dome lens and daylight blocking filter. Filter is matched with IR emitters operating at wavelength of 830 nm to 950 nm. The photo sensitive area of the chip is 0.23 mm2. FEATURES • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.
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