S8G
FEATURES
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Material categorization: for definitions of pliance please see .vishay./doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
TYPICAL APPLICATIONS
For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes for consumer, and telemunication.
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM
IR VF at IF = 8 A (TJ = 125 °C)
TJ max. Package
8.0 A 400 V, 600 V, 800 V, 1000 V
220 A 10 μA 0.85 V 150 °C SMC (DO-214AB)
Circuit configuration
Single
MECHANICAL DATA
Case: SMC (DO-214AB) Molding pound meets UL 94 V-0 flammability rating Base P/N-E3
- Ro HS-pliant, mercial grade Base P/N-M3
- halogen-free, Ro HS-pliant, mercial grade
Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102...
