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NS8DT - Glass Passivated General Purpose Plastic Rectifier

Download the NS8DT datasheet PDF. This datasheet also covers the NS8AT variant, as both devices belong to the same glass passivated general purpose plastic rectifier family and are provided as variant models within a single manufacturer datasheet.

Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Low forward voltage drop.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package).
  • AEC-Q101 qualified available - Automotive ordering code: base P/NHE3 (for ITO-220AC and TO-263AB package).
  • Material categorization: for definitions o.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (NS8AT-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number NS8DT
Manufacturer Vishay
File Size 138.55 KB
Description Glass Passivated General Purpose Plastic Rectifier
Datasheet download datasheet NS8DT Datasheet

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Other Datasheets by Vishay

Part Number Description
NS8AT Glass Passivated General Purpose Plastic Rectifier
NS8BT Glass Passivated General Purpose Plastic Rectifier
NS8GT Glass Passivated General Purpose Plastic Rectifier
NS8JT Glass Passivated General Purpose Plastic Rectifier
NS8KT Glass Passivated General Purpose Plastic Rectifier

Full PDF Text Transcription

Click to expand full text
www.vishay.com NS8xT, NSF8xT, NSB8xT Vishay General Semiconductor Glass Passivated General Purpose Plastic Rectifier TO-220AC ITO-220AC NS8xT PIN 1 PIN 2 2 1 NSF8xT PIN 1 CASE PIN 2 D2PAK (TO-263AB) K 2 1 2 1 NSB8xT PIN 1 K PIN 2 HEATSINK DESIGN SUPPORT TOOLS click logo to get started Models Available PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM VF TJ max. Package 8.0 A 50 V to 1000 V 125 A 1.1 V 150 °C TO-220AC, ITO-220AC, D2PAK (TO-263AB) Circuit configuration Single FEATURES • Power pack • Glass passivated pellet chip junction • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max.
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