GPP20M
FEATURES
- Glass passivated chip junction
- Low forward voltage drop
- Low leakage current, typical IR less than 0.1 μA
- High forward surge capability
- Meets environmental standard MIL-S-19500
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of pliance please see .vishay./doc?99912
PRIMARY CHARACTERISTICS
IF(AV) VRRM
2.0 A
50 V, 100 V, 200 V, 400 V, 600 V, 800 V, 1000 V
IFSM IR
VF at IF = 2.0 A TJ max. Package
70 A 5.0 μA 1.1 V 150 °C DO-15 (DO-204AC)
Circuit configuration
Single
TYPICAL APPLICATIONS For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application.
MECHANICAL DATA Case: DO-15 (DO-204AC), molded epoxy over passivated chip Molding pound meets UL 94 V-0 flammability rating Base P/N-E3
- Ro HS-pliant, mercial grade Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker test Polarity: color band denotes...
