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BYV29-300 - Ultrafast Rectifier

Datasheet Summary

Features

  • Glass passivated chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low forward voltage drop.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package).
  • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.

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Datasheet Details

Part number BYV29-300
Manufacturer Vishay
File Size 164.36 KB
Description Ultrafast Rectifier
Datasheet download datasheet BYV29-300 Datasheet
Additional preview pages of the BYV29-300 datasheet.

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Full PDF Text Transcription

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UG(F,B)8FT & UG(F,B)8GT, BYV29(F,B)-300 & BYV29(F,B)-400 Vishay General Semiconductor Ultrafast Rectifier TO-220AC ITO-220AC 2 BYV29, UG8 Series PIN 1 PIN 2 2 1 BYV29F, UGF8 Series PIN 1 1 CASE PIN 2 TO-263AB K FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package) • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, and other power switching application.
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