VESD05C-FC1
Description
Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic.
Features
- ESD protection to IEC 61000-4-2 30 k V (air)
- ESD protection to IEC 61000-4-2 8 k V (contact)
- ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 m A
- 120 W peak pulse power dissipation per line (8/20 µs)
- Suitable for high frequency applications (low capacitance, low parasitic inductance)
- Low clamping voltage
- Minimum PCB space needed (0.5 mm2), < 0.55 mm height, only 0.47 mg/pcs
- No need for underfill material and/or additional solder
- Can be assembled using standard SMT pick & place equipment, reflow processes per J-STD-020 and assembly methods
- Green product
Applications
Cellular phones Personal digital assistants (PDA), notebook puters...
