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VM50-850-C4 - VCSEL

Download the VM50-850-C4 datasheet PDF. This datasheet also covers the VM50-850-C1 variant, as both devices belong to the same vcsel family and are provided as variant models within a single manufacturer datasheet.

General Description

These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, a

Key Features

  • 4-ch or 12 chip arrays.
  • Up to 56 Gbit/s per channel.
  • Device-to-device pitch of 250 µm.
  • Suitable for wire or flip-chip bonding.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VM50-850-C1-VIS.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VM50-850-C4
Manufacturer VIS
File Size 871.60 KB
Description VCSEL
Datasheet download datasheet VM50-850-C4 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Datasheet VM50-850-Cxx 56 Gbit/s VCSEL (850 nm) Contact type: GS/SG Product Code: VM50-850-C1 VM50-850-C4 VM50-850-C12 1x1 4x1 12x1 Sample image only. Actual product may vary. Product Description These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, and next-generation optical data communications systems. The VCSELs are contacted on the top-surface individually using ground-source (GS) microprobes, wire bonds, or flip-chip bonds.