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V50-850-C1 - VCSEL

Description

Sample image only.

Actual product may vary.

Features

  • 4-ch or 12 chip arrays.
  • Up to 56 Gbit/s per channel.
  • Device-to-device pitch of 250 µm.
  • Suitable for wire or flip-chip bonding.

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Datasheet Details

Part number V50-850-C1
Manufacturer VIS
File Size 657.11 KB
Description VCSEL
Datasheet download datasheet V50-850-C1 Datasheet

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Other Datasheets by VIS

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V50-850-C12 VCSEL
V50-850-C4 VCSEL

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Datasheet V50-850-Cxx 50 Gbit/s VCSEL (850 nm) Contact type: GS/SG Product Code: V50-850-C1 1x1 V50-850-C4 4x1 V50-850-C12 12x1 Product Description Sample image only. Actual product may vary. These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in the development and evaluation of optical interconnections, optical backplanes and integrated waveguides, and next-generation optical data communications systems. The VCSELs are contacted on the top-surface individually using ground-source (GS) microprobes, wire bonds, or flip-chip bonds.
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