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SMT970 - 970nm High Performance TOP IR LED

Features

  • Chip Material : GaAs.
  • Chip Dimension : 400um.
  • 400um.
  • Number of Chips : 1pce.
  • Peak Wavelength : 970nm typ.
  • Lead Frame Die : Silver Plated on Copper.
  • Package Resin : PA6T.
  • Lens : Silicone or Epoxy Resin.

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Datasheet Details

Part number SMT970
Manufacturer USHIO
File Size 173.66 KB
Description 970nm High Performance TOP IR LED
Datasheet download datasheet SMT970 Datasheet

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Full PDF Text Transcription

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Data Sheet SMT970 970nm High Performance TOP IR LED Outline and Internal Circuit (Unit : mm) Features • Chip Material : GaAs • Chip Dimension : 400um * 400um • Number of Chips : 1pce • Peak Wavelength : 970nm typ. • Lead Frame Die : Silver Plated on Copper • Package Resin : PA6T • Lens : Silicone or Epoxy Resin Application Absolute Maximum Ratings (Tc=25°C) Item Symbol Ratings Power Dissipation PD 150 Forward Current IF 100 Pulse Forward Current IFP 1000 Reverse Voltage VR 5 Thermal Resistance Rthja 80 Junction Temperature Tj 120 Operating Temperature Topr -40 ~ +100 Storage Temperature Tstg -40 ~ +100 Soldering Temperature TSOL 250 ‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us.
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