IRF7342TR
Description
The SOP-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
2.Features
VDS (V)=-55V RDS(ON)<105mΩ(VGS=-10) RDS(ON)<170mΩ(VGS=-4.5V) Generation V Technolog Ultra Low On-Resistance Surface Mount Dynamic dv/dt Rating Fast Switching Lead-Free
3.Pinning information
Pin
Symbol Description
SOP-8
D1 D1 D2 D2
D1
D2
2,4 1,3 5,6,7,8
GATE
SOURCE
DRAIN
G1
G2
S1 G1 S2 G2
S1
S2
4.Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter Drain-Source Voltage Continuous Drain Current, VGS=10V Continuous Drain Current, VGS=10V Pulsed Drain Current æ Power...
