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MA4SPS302 - Surface Mount Monolithic PIN Diode Chip

General Description

M/A-COM’s MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM’s patented HMIC™ process.

Key Features

  • Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Case Style ODS-12471, 2 A B.

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Other Datasheets by Tyco Electronics (now TE Connectivity)

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MA4ST320 Low - Voltage / Wide Band Si Hyperabrupt Varactors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MA4SPS302 SurMount™ Series Surface Mount Monolithic PIN Diode Chip Features • • • • • • • Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) Case Style ODS-12471, 2 A B Description M/A-COM’s MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal side walls conductive. Selective backside metalization is applied producing a surface mount device.