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SW-461 - 4x6 RF Switch Matrix

Description

M/A-COM’s SW-461 is a multi-chip module containing six SP4T GaAs switches, each with a driver/decoder and four GaAs 6-way power dividers.

The SW-461 utilizes Plastic Ball Grid Array (PBGA) interconnect technology to achieve high circuit density and superior high frequency performance.

Features

  • High Isolation: 40 dB Low Current draw: < 2mA @ +5 V < 10mA @ -5V 5V CMOS Logic 45mm PBGA Package JEDEC MO-151 Foot Print PBGA Package Outline.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com SW-461 4x6 RF Switch Matrix 800 - 900 MHz Features • • • • • High Isolation: 40 dB Low Current draw: < 2mA @ +5 V < 10mA @ -5V 5V CMOS Logic 45mm PBGA Package JEDEC MO-151 Foot Print PBGA Package Outline Description M/A-COM’s SW-461 is a multi-chip module containing six SP4T GaAs switches, each with a driver/decoder and four GaAs 6-way power dividers. The SW-461 utilizes Plastic Ball Grid Array (PBGA) interconnect technology to achieve high circuit density and superior high frequency performance. This device is ideal for telephony applications in the AMPS frequency bands. The SW-461 is constructed with a multi layer PCB using a ball grid array for the I/O connects. The combination of several state-of-the-art technologies achieves high performance at a low cost.
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