Additional preview pages of the MUR3060G datasheet.
Product details
Features
Glass passivated chip junction EPI wafer Ultrafast recovery time for high efficiency Low reverse leakage current High surge capacity
Mechanical Data
Case: TO-220AC heatsink Terminals: Lead solderable per MIL-STD-202, Method 208 Polarity: As marked Standard packaging: Any Weight: 2.5 gram approximately
TO-220AC
.419(10.66) .387(9.85)
.139(3.55) MIN
.269(6.85) .226(5.75) .624(15.87) .548(13.93)
Unit : inch (mm)
.196(5.00) .163(4.16) .054(1.39) .045(1.15)
.177(4.5)MAX .50(12.7.
MUR3060G Datasheet
