Datasheet4U Logo Datasheet4U.com

S172 - Commercial Electromechanical Relay

Description

The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications.

Features

  • and manufacturing techniques provide overall high reliability and excellent resistance to environmental extremes:.
  • All welded construction.
  • High force/mass ratios for resistance to shock and vibration.
  • Unique uni-frame design providing high magnetic efficiency and mechanical rigidity.
  • Advanced cleaning techniques provide maximum assurance of internal cleanliness.
  • Precious metal alloy contact material with gold plating assures excellent high curre.

📥 Download Datasheet

Datasheet preview – S172

Datasheet Details

Part number S172
Manufacturer Teledyne
File Size 486.08 KB
Description Commercial Electromechanical Relay
Datasheet download datasheet S172 Datasheet
Additional preview pages of the S172 datasheet.

📁 Similar Datasheet

  • S17-05N-1 - PROXIMITY SWITCH (HIGHLY)
  • S17-05N-2 - PROXIMITY SWITCH (HIGHLY)
  • S17-05P-1 - PROXIMITY SWITCH (HIGHLY)
  • S17-05P-2 - PROXIMITY SWITCH (HIGHLY)
  • S1700B-xxxx - (S17xx-xxxx) Crystal Clock Oscillator (SaRonix)
  • S1700C-xxxx - (S17xx-xxxx) Crystal Clock Oscillator (SaRonix)
  • S1703B-xxxx - (S17xx-xxxx) Crystal Clock Oscillator (SaRonix)
  • S1703C-xxxx - (S17xx-xxxx) Crystal Clock Oscillator (SaRonix)
  • S1732 - NPN Transistor (Toshiba)
  • S175-50 - COMMN EMITTER (Microsemi)
Other Datasheets by Teledyne
  • S172D - Commercial Electromechanical Relay

Full PDF Text Transcription

Click to expand full text
Series S172 SMT, DPDT Non-Latching Commercial Electromechanical Relay CENTIGRID® SURFACE MOUNT COMMERCIAL RELAYS DPDT SERIES  S172  S172D RELAY TYPE ​SMT-J mounted, non-latching DPDT SMT-J mounted, non-latching DPDT relay with internal diode for coil transient suppression DESCRIPTION The S172 feature: The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (.370) and .100” grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed J-leads are pre-tinned to make the relays ideal for all types of surface-mount solder reflow processes.
Published: |