Download BAV20 Datasheet PDF
Taiwan Semiconductor
BAV20
FEATURES - Fast switching device (trr<4.0ns) - Through-hole device type mounting - Hermetically sealed glasss - Solder hot dip tin (Sn) lead finish - All external surfaces are corrosion resistant and leads are readily solderable - Packing code with suffix "G" means Halogen free MECHANICAL DATA - Case: DO-35 package - High temperature soldering guaranteed: 260o C/10s - Polarity: Indicated by black cathode band - Weight: 109 ± 4 mg DO-35 Hermetically Sealed Glass MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25o C unless otherwise noted) PARAMETER SYMBOL VALUE Power Dissipation Peak Forward Surge Current Pulse Width = 1 s , Square Wave Pulse Width = 1 μs , Square Wave PD IFSM 500 1 4 Average Forward Current Thermal Resistance (Junction to Ambient) Junction and Storage Temperature Range IO RθJA TJ , TSTG 200 300 -65 to +200 PARAMETER BAV19 Reverse Breakdown Voltage IR = 100 μA BAV21 Forward Voltage Reverse Leakage Current Junction Capacitance IF = 100 m A IF...