FFM107
Features
Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Tiny plastic SMD package. High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet Ro HS requirments.
Mechanical data
Case : Molded plastic, SMA Polarity : Indicated by cathode band Mounting Position : Any Weight : Approximated 0.01gram
SMA/DO-214AC
0.063(1.60) 0.051(1.30)
0.096(2.45) 0.078(2.00) 0.059(1.50) 0.035(0.90)
0.181(4.60) 0.161(4.10)
0.108(2.75) 0.096(2.45)
0.209(5.30) 0.193(4.90)
0.012(0.30) 0.006(0.15)
0.008(0.20) 0.002(0.05)
Dimensions in inches and(millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25o C ambient temperature unless otherwise specified.
Maximum ratings
PARAMETER Forward rectified current
See Fig.2
CONDITIONS
Forward surge current
Reverse current...
