Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.5 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions
PD VF RthJA TJ TSTG
IF=200mA
Note: Valid provided that leads at a distance of 8mm from case are kep
Features
Planar Die Construction.
500mW Power Dissipation.
Very Sharp Reverse Characteristic.
Very High Stability www. DataSheet4U. com.
Low Reverse Current Level.
Standard Zener Voltage Tolerance is ± 5 %.
Ideally Suited for Automated Assembly Processes.
RoHS Compliant
MiniMelf
Mechanical Data
Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-750, Method 2026 Color band denotes cathode end Approx. 0.03.
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500mW Surface Mount Zener Diodes ZMMC2V4 – ZMMC100
500mW Surface Mount Zener Diodes
Features
• Planar Die Construction • 500mW Power Dissipation • Very Sharp Reverse Characteristic • Very High Stability www.DataSheet4U.com • Low Reverse Current Level • Standard Zener Voltage Tolerance is ± 5 % • Ideally Suited for Automated Assembly Processes • RoHS Compliant
MiniMelf
Mechanical Data
Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-750, Method 2026 Color band denotes cathode end Approx. 0.03 grams
Maximum Ratings & Electrical Characteristics (T Ambient=25ºC unless noted otherwise)
Symbol Description Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.5 0.
ZMMC10 Datasheet
