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WLAN Product Brief LBWA18HEPZ
WLAN 802.11b/g module
Features and Benefits
• • • • • Thin package:1.3mm typ, 1.4mm max. Small footprint:8.2mm x 8.4mm Multiple power-save modes to maximize battery life Advanced Security Bluetooth active signaling interface for optimum packet efficiency QoS Packet prioritization for time sensitive payload OS Support for Windows Mobile, Linux WLAN SDIO / SPI Host Interfaces
The LBWA18HEPZ is an IEEE 802.11b/g wireless LAN module requiring just 64 square millimeters of host PCB area. Integrated within the module are a host of active and passive components resulting in a single simple package for the customer.
LBWA18HEPZ Datasheet
