Datasheet4U Logo Datasheet4U.com

SKY77806 - Multiband Front-End Module

Description

The SKY77806, a multiband LTE Front-End Module (FEM), efficiently supports 4G handset operation.

The FEM consists of a PA block, a logic control block for multiple power control levels, band enable functions, and integrated duplex filters with single-ended receive outputs.

Features

  • SkyShield™ shielded module.
  • Average Power Tracking (APT).
  • 50 ohm input/output impedance with internal DC-blocking.
  • Temperature Sensor.
  • MiPi RFFE Control Interface w/ 1.8 V Nominal Supply, Separate Vcc1/Vcc2, Completely Operable for VIO High and Vbatt Low, Continuous Bias Adjustment vs. Power.
  • Downlink Carrier Aggregation for LTE with state-of-the-art desense performance.
  • Low Supply voltage.
  • Excellent harmonic and n.

📥 Download Datasheet

Datasheet Details

Part number SKY77806
Manufacturer Skyworks Solutions
File Size 181.46 KB
Description Multiband Front-End Module
Datasheet download datasheet SKY77806 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
SKY77148 PA Module for CDMA2000 (450-460 MHz) ETC
SKY77518 TX-RX iPAC FEM Skyworks
SKY77518-21 FEM FOR DUAL-BAND GSM/GPRS Skyworks
SKY73022-11 High Gain and Linearity Diversity Downconversion Mixer Skyworks
SKY73025 High Gain and Linearity Diversity Downconversion Mixer Skyworks

Other Datasheets by Skyworks Solutions

Part Number Description
SKY77824-11 Power Amplifier Module
SKY77149 PA Module
SKY77154 System Smart PA Module
SKY77161 PA Module
SKY77162 System Smart Power Amplifier Module

Full PDF Text Transcription

Click to expand full text
PRODUCT SUMMARY SKY77806 Multiband Front-End Module for LTE Bands 12 / 17, 13 Applications • Multiband 2G, 3G/4G handsets - LTE-modulated handsets for Bands 12 / 17, 13 Description The SKY77806, a multiband LTE Front-End Module (FEM), efficiently supports 4G handset operation. The FEM consists of a PA block, a logic control block for multiple power control levels, band enable functions, and integrated duplex filters with single-ended receive outputs. The RF I/O ports internally matched to 50 ohms minimize the need for external components. Extremely low leakage current maximizes handset standby time. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in silver plated plastic overmold.
Published: |