SQ918 - Chip Type 2C918 Geometry 0013 Polarity NPN

Features

• High frequency rating Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.7 mils x 2.7 mils 2.7 mils x 2.7 mils 8 mils nominal 16 mils x 16 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO hFE Test conditions IC = 3.0 mA, IB = 0 IC = 10 µA, IE = 0 IE = 10 µA, IC = 0 VCB = 15 V, IE = 0 IC = 3.0 mA dc, VCE = 1.0 V Min 15 30 3.0 --20 Max --.