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SQ3019 - Chip Type 2C3019 Geometry 4500 Polarity PNP

Datasheet Summary

Features

  • Radiation graphs available Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 12 kÅ min. Au - 6.5 kÅ nom. 2.3 mils x 7.0 mils 5.0 mils x 11.0 mils 8 mils nominal 30 mils x 30 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCBO BVEBO ICBO Test conditions IC = 100 µA, IE = 0 IE = 100 µA, IC = 0 VCB = 40 V, IE = 0 Min 140 7.0 --- Max ----10 Unit V dc V dc nA hFE IC = 150 mA dc, VCE = 10 V 100 300.

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Datasheet Details

Part number SQ3019
Manufacturer Semicoa Semiconductor
File Size 31.35 KB
Description Chip Type 2C3019 Geometry 4500 Polarity PNP
Datasheet download datasheet SQ3019 Datasheet
Additional preview pages of the SQ3019 datasheet.

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Full PDF Text Transcription

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Data Sheet No. 2C3019 Chip Type 2C3019 Geometry 4500 Polarity PNP Generic Packaged Parts: 2N3019, 2N3057 Chip type 2C3019 by Semicoa Semiconductors provides performance similar to these devices. Part Numbers: 2N3019, 2N3019S, 2N3019UB, 2N3057, 2N3057A, 2N3700, 2N3700UB, SD3019F, SQ3019, SQ3019F Product Summary: APPLICATIONS: Designed for general purpose switching and amplifier applications. Features: Radiation graphs available Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 12 kÅ min. Au - 6.5 kÅ nom. 2.3 mils x 7.0 mils 5.0 mils x 11.
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