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HW-XX-XX-XX-X-XXXX-SM-X-XXX - HW BOARD-TO-BOARD ASSEMBLY

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REVISION AZ DO NOT SCALE FROM THIS PRINT NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. HW-XX-XX-XX-X-XXXX-SM-X-XXX 2. TUBE POSITIONS -05 THRU -36 ONLY; POSITIONS -02 THRU -04 TO BE LAYER PACKAGED. 3. MAXIMUM CUT FLASH: .020 [0.51] CUT FLASH TO BE No OF POSITIONS IN A NON-CRITICAL AREA LOCATED BETWEEN BODIES. -02 THRU -36 4. FOR ADDED MECHANICAL STABILITY, SAMTEC RECOMMENDS MECHANICAL BOARD SPACERS BE USED IN APPLICATIONS WITH GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT LEAD STYLE (SEE TABLE 1) IPG@SAMTEC.COM FOR MORE INFORMATION. PLATING SPECIFICATION OPTION #2 POLARIZED POSITION SPECIFY OMITTED PIN OPTION #1 -LC: LOCKING CLIP (SEE FIG 2, SHT 2) (-D: USE RTSM-50-DVU, USE LC-05-TM) 36 02 .195 4.95 REF 35 .100 2.
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