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M391B1G73BH0 - 240pin Unbuffered DIMM based on 4Gb B-die

General Description

7 7.

SPD and Thermal Sensor for ECC UDIMMs 7 8.

Input/Output Functional Description 8 8.1 Address Mirroring Feature 9 8.1.1.

Key Features

  • 4 3. Address Configuration 4 4. x64 DIMM Pin Configurations (Front side/Back side) 5 5. x72 DIMM Pin Configurations (Front side/Back side) 6 6. Pin.

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Full PDF Text Transcription for M391B1G73BH0 (Reference)

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Rev. 1.3, May. 2012 M378B5173BH0 M378B1G73BH0 M391B1G73BH0 240pin Unbuffered DIMM based on 4Gb B-die 78FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSU...

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78FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by imp

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