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K9K8G08U0F - 4Gb F-die NAND Flash

General Description

5 1.2

Key Features

  • 5 1.3 Product List 5 1.4 Pin Configuration (TSOP1) 6 1.4.1 Package Dimensions 6 1.5 Pin Configuration (TSOP1) 7 1.5.1 Package Dimensions 7 1.6 Pin Configuration (FBGA) 8 1.7 Package Dimensions 8 1.8 Pin.

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Full PDF Text Transcription for K9K8G08U0F (Reference)

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SAMSUNG CONFIDENTIAL Rev. 1.2, Jul. 2016 K9F4G08U0F K9K8G08U0F K9WAG08U1F 4Gb F-die NAND Flash Single-Level-Cell (1bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES THE RI...

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e-Level-Cell (1bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwis