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Thermal Data www.DataSheet4U.com
SDIP 30
30 leads
PACKAGE MATERIAL LIST
item #
leadframe die attach
molding compound
material
copper epoxy glue ( silver filler ) epoxy resin
thickness 0.25 mm 10-40 µm 3.8 mm
thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time
September 1999
1/2
Thermal Data
Rth(j-a) (ºC/W) 75
1)
70
65
SDIP 30
www.DataSheet4U.com
die size 160x80 sq. mils mounted on a low K board (1s 1 Oz.)
80x80 sq. mils dissipating area
60
80x160 sq. mils dissipating area
55
0
0.5
1
1.5
2
2.5
dissipated power ( Watt )
Zth( ºC/W)
2)
10
die size 160x80 sq. mils 80x80 sq. mils dissipating area mounted on a low K board (1s 1 Oz.)
0.001
0.01
0.
SDIP30 Datasheet
