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Thermal Data
SO 14
14 leads PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.20 mm 10-40 µm
molding compound
1.65 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size
February 1998 1/2
Thermal Data
SO 14
Rth(j-a) (ºC/W) 220
die size = 60 x 90 sq.mils
1)
200
180
floating in air
160
mounted on :
140
SM PCB1A SGS board
120
SM PCB1 SGS board
100
alumina
80 0 0.2 0.4 0.6 0.8 1 1.2 dissipated power ( Watt ) 1.4 1.6 1.8 2
Transient Thermal Resistance (ºC/W) 200
SINGLE PULSE
100
mounted on SM PCB1 SGS board Pd = 1,5 Watt
50
2)
20 10
die size = 60 x 90 sq.mils on die dissipating area = 2000 sq.
SO14 Datasheet
