HSP061-4NY8 - 4-line ESD protection

Features

Very compact 500 µm pitch package, for easy PCB layout.
Ultra-large bandwidth: 18 GHz.
Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND).
Low leakage current: < 1 nA.
Extended operating junction temperature range: -40 °C to 150 °C.
Thin package: 0.4 mm max.
RoHS compliant Benefits.
High ESD protection level.
High integration.
Suitable for high density boards Complies with the following standards.
MIL-STD 883G method 3015.

ST Microelectronics

Datasheet Details

Part number	HSP061-4NY8
Manufacturer	STMicroelectronics
File Size	719.18 KB
Description	4-line ESD protection
Datasheet	HSP061-4NY8 Datasheet
Additional preview pages of the HSP061-4NY8 datasheet.

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Full PDF Text Transcription

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HSP053-4M5 4-line ESD protection for high speed lines Datasheet - production data µQFN-5L package Features  Very compact 500 µm pitch package, for easy PCB layout  Ultra-large bandwidth: 18 GHz  Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)  Low leakage current: < 1 nA  Extended operating junction temperature range: -40 °C to 150 °C  Thin package: 0.4 mm max.

Published: Jun 30, 2010 |