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S75WS256N - Stacked Multi-Chip Product

This page provides the datasheet information for the S75WS256N, a member of the S75WS-N Stacked Multi-Chip Product family.

Datasheet Summary

Description

of Spansion data sheet designations are presented here to highlight their presence and definitions.

The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production.

Features

  • Power supply voltage of 1.7 V to 1.95 V.
  • High Performance.
  • 54 MHz, 66 Mhz, 80 MHz.
  • Packages.
  • 9 x 12 mm 84 ball FBGA.
  • 11 x 13 mm 115 ball FBGA.
  • Operating Temperature.
  • Wireless,.
  • 25°C to +85°C Publication Number S75WS-N_02 Revision A Amendment 2 Issue Date October 6, 2005 P r e l i m i n a r y Contents S75WS-N Based MCPs.
  • i 1 2 3 4 5 Product.

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Datasheet preview – S75WS256N

Datasheet Details

Part number S75WS256N
Manufacturer SPANSION
File Size 269.45 KB
Description Stacked Multi-Chip Product
Datasheet download datasheet S75WS256N Datasheet
Additional preview pages of the S75WS256N datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com S75WS-N Based MCPs Stacked Multi-Chip Product (MCP) 256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory with 128 Mb (8M x 16-Bit) RAM Type 4 and 512 Mb (32M x 16-bit) Data Flash or 1 Gb ORNAND Flash Data Sheet PRELIMINARY Notice to Readers: This document indicates states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that a product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.
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