AM41DL3208G Datasheet Stacked Multi-Chip Package (MCP) Flash Memory/SRAM

Manufacturer: Spansion (now Infineon)

AM41DL3208G stacked multi-chip package (mcp) flash memory/sram by Spansion (now Infineon) - Datasheet Preview

Datasheet Details

Part number	AM41DL3208G
Manufacturer	Spansion (now Infineon)
File Size	1.70 MB
Description	Stacked Multi-Chip Package (MCP) Flash Memory/SRAM
Download	AM41DL3208G Download (PDF)

Overview

www.DataSheet4U.com Am41DL3208G Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu.

Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.

Continuity of Specifications There is no change to this datasheet as a result of offering the device as a Spansion product.

Key Features

I Power supply voltage of 2.7 to 3.3 volt I High performance.
Access time as fast as 70 ns.
10 mA active read current at 5 MHz.
200 nA in standby or automatic sleep mode I Minimum 1 million write cycles guaranteed per sector I 20 Year data retention at 125°C.
Reliable operation for the life of the system I Package.
73-Ball FBGA I Operating Temperature.
40°C to +85°C.

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