S07M
Features
- 低的反向漏电流 Low reverse leakage
- 玻璃钝化芯片 Glass passivated chip junction
- 较强的正向浪涌承受能力 High forward surge capability
- 高温焊接保证 260℃/10秒 High temperature soldering guaranteed: 260℃/10 seconds at terminals
- 引线和管体皆符合 Ro HS 标准。Lead and body according with Ro HS standard
机械数据 Mechanical Data
- 封装: 塑料封装 Case: Molded plastic body
- 端子: 焊料被镀 Terminals: Solder plated
- 极性: 色环端为负极 Polarity: Color band denotes cathode end
- 安装位置: 任意 Mounting Position: Any
极限值和温度特性 TA = 25℃ 除非另有规定。 Maximum Ratings & Thermal Characteristics Ratings at 25℃ambient temperature unless otherwise specified.
最大反向峰值电压
Maximum repetitive peak reverse voltage
最大反向有效值电压
Maximum RMS voltage
最大直流阻断电压
Maximum DC blocking voltage
最大正向平均整流电流
Maximum average forward rectified current
正向峰值浪涌电流 8.3ms单一正弦半波
Peak forward surge current 8.3 ms single half sine-wave
最大反向峰值电流 @TA = 75℃
Maximum peak reverse current full cycle
典型热阻
Typical thermal resistance
工作结温和存储温度
Operating junction and storage temperature range
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