FR3M
Features
:
- Fast switching for high efficiency
- Low leakage current
- High forward surge capability
- Solder dip 260°C, 40s
- ponent in accordance to Ro HS 2002/95/EC and WEEE 2002/96/EC
- Glass passivated chip junction
Mechanical Data:
- Case: JEDEC DO-214AC molded plastic body over passivated chip
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Weight: 0.23 grams
Mechanical Dimensions: In mm / Inches
FR3A
MARKING, MOLDING RESIN Marking for FR3A/B/C/D/G/J/M, 1st row FR3A/B/C/D/G/J/M, 2nd row YYWWL Where YY is the manufacture year
WW is the manufacture week code L is the wafer’s Lot Number
- China
- Germany
- Korea
- Singapore
- United States
- - http://.smc-diodes.
- sales@ smc-diodes.
- Technical Data Data Sheet N1742,...
